Etching method and apparatus

ABSTRACT

The invention intends to provide an etching method in which a bank  12  is formed to a member to be processed  10,  and thereby a precise etching can be applied to a predetermined position, and apparatus for the method.  
     In a range outside of a predetermined pattern of the member to be processed  10,  a liquid repelling bank  12  is formed, and by use of a discharge head  16  a coating liquid  14  such as an etching liquid  15  is coated on an etching portion  18  of the predetermined pattern. The etching portion  18  is rendered lyophilic by treatment to improve the fixing properties of the coating liquid  14,  and the bank  12  is formed of a liquid repelling film, and thereby the coating liquid  14  is inhibited from adhering to the bank  12.

BACKGROUND OF THE INVENTION

[0001] 1. Field of Invention

[0002] The present invention relates to an etching method by which partof a surface or a front surface of a member-to-be-processed is removed,and an apparatus for the method. In particular, the invention relates toan etching method, in which a bank is disposed to amember-to-be-processed and thereby a coating region of a coating liquidis selectively etched, and an apparatus for the method.

[0003] 2. Description of Related Art

[0004] When elements and wiring patterns are formed on amember-to-be-processed, such as a silicon wafer, photoresist is coatedon a surface of the member-to-be-processed, and patterned according tophotolithography, and with it as a mask, wet etching with a coatingliquid for use in etching, such as an HF aqueous solution, or dryetching with plasma is applied. In such etching methods, however, sincea non-etching portion is protected by forming a mask on a surface of amember-to-be-processed, many materials are necessary to form the maskand many man-hours are required, resulting in an increase in the cost.

[0005] In this connection, a method in which the etching is carried outwithout forming a mask is disclosed in JP-A-2001-185526. In this method,as a liquid discharge device, a discharge head according to an ink-jetmethod is installed and controlled, thereby an etching liquid isdirectly coated on an member-to-be-processed according to apredetermined pattern, and thereby etching is performed.

[0006] In the etching method where an etching liquid is directlydischarged on a surface of an member-to-be-processed, however, a size ofa liquid droplet to be discharged is determined according to a shape ofa discharge nozzle of the ink-jet system. That is, since a surface areaof a coating liquid, dropped on a surface of a member-to-be-processed,is determined according to a nozzle shape, it is impossible to etch ashape smaller than a discharge diameter of a nozzle. Furthermore, ashape of thus etched pattern reflects the shape of the liquid droplet,and becomes a round point or a line or a plane made of successive roundpoints. Thus, in the etching in which a related art discharge nozzle isused, since a liquid spreads according to the wettability and so on ofthe member-to-be-processed, not only a shape smaller than the dischargediameter but also a complicated shape and an edge are difficult to form.Furthermore, there is a problem in that when an etching liquid that isapplied from a discharge nozzle scatters and sticks to other portionthan a portion-to-be-etched, the etching other than a predeterminedpattern is implemented. Still furthermore, since a shape of the etchingdepends on an adhesion state of the etching liquid, a shape accuracybecomes poor, resulting in incapability of implementing fine etching.

[0007] Still furthermore, in a multi-layered film where a plurality offilms of the member-to-be-processed is laminated and in the case of aplurality of films of the member-to be-processed being present on thesame plane, the etching is carried out by exchanging the etching liquidaccording to the type of member-to-be-processed. Accordingly, a similarprocess has to be repeated for each of all types of themembers-to-be-processed. As a result, the etching when there are filmsof different members-to-be-processed takes many man-hours.

[0008] Furthermore, when a reactive gas, a liquid capable of dissolvingthe reactive gas, and a member-to-be-processed are reacted to carry outthe etching, in some cases, the reactive gas remains in the surroundingsof the member-to-be-processed. Accordingly, there is a concern in that aresidual reactive gas and so on react with other materials and therebygenerate unnecessary reaction products, the reaction products may adhereonto a surface of the member-to-be-processed and intervenes at anetching portion, and thereby excellent patterning is disturbed.

SUMMARY OF THE INVENTION

[0009] The invention addresses or solves the above and/or otherproblems, and provides an etching method in which in order to enable toetch a necessary position of a member-to-be-processed, a liquidrepelling bank is formed or the wettability of a portion other than anetching portion is enhanced, and thereby accurate etching can be appliedto a predetermined position, and an apparatus for the method can beprovided.

[0010] In order to address or overcome the above, an etching methodaccording to the invention is provided such that a bank is disposed inthe surroundings of an etching portion of a member-to-be-processed, anetching liquid is supplied inside of the bank by use of a liquiddischarge device, and thereby the etching portion is etched. Accordingto the method, since only the etching portion is coated with an etchingliquid by use of the liquid discharge device, the etching liquid can beinhibited from being excessively used, and since a range of etchingportion is limited by use of the bank, accurate etching can beperformed.

[0011] Furthermore, in the etching method according to the invention,the etching portion can be etched by disposing a bank in thesurroundings of the etching portion of the member-to-be-processed, bymaking the surroundings of the etching portion an atmosphere of areactive gas, and by supplying a liquid capable of dissolving thereactive gas in the bank by use of the liquid discharge device. Thus, inthe etching that uses the reactive gas and the liquid capable ofdissolving the reactive gas, the etching portion is provided with thebank, and thereby the liquid is inhibited from diffusing. Stillfurthermore, the liquid can be inhibited from being excessively used.Since a range of the etching portion is limited by the bank, accurateetching can be applied.

[0012] In addition, the etching portion can be rendered lyophilic bytreatment. Thus, when the liquid repelling treatment is applied to thebank, and the lyophilic treatment is applied to the etching portion, thefixing properties of the etching liquid or the liquid can be enhanced.

[0013] Furthermore, the etching portion of the member-to-be-processed isrendered lyophilic by treatment, the etching liquid is fed to theetching portion by the liquid discharge device, and thereby the etchingportion can be etched. Thereby, without forming the bank, the etchingliquid can be fixed to the etching portion, and thereby accurate etchingcan be carried out.

[0014] Still furthermore, the etching portion of themember-to-be-processed is rendered lyophilic by treatment, thesurroundings of the etching portion are made into an atmosphere of thereactive gas, and the liquid capable of dissolving the reactive gas isfed to the etching portion by use of the liquid discharge device, andthereby the etching portion can be etched. Thereby, without forming thebank, the etching liquid can be fixed to the etching portion, andthereby accurate etching can be carried out.

[0015] The above etching can be carried out while removing the reactionproduct by suction. That is, since the reaction product in the etchingportion is rapidly removed, a disturbing of the etching by a remainingreaction product can be inhibited, resulting in excellent etching.

[0016] Furthermore, the etching can be applied to themember-to-be-processed by heating. Thereby, the etching is promoted inthe speed, resulting in rapid and excellent etching.

[0017] Still furthermore, the heating of the member-to-be-processed iscarried out at a temperature in the range of 30 to 60 degree centigrade.Thereby, the reaction with the member-to-be-processed is promoted, andthe liquid used in the etching can be inhibited from vaporizing,resulting in rapid etching.

[0018] Furthermore, the bank is preferably rendered liquid repelling bytreatment, or is preferable to be liquid repelling. Thus, when the bankis rendered liquid repelling by treatment, the etching liquid can beinhibited from diffusing from the etching portion, and precise etchingcan be performed.

[0019] Still furthermore, the bank is provided such that it is made of afluororesin film. Since the fluororesin is highly liquid repelling toall liquids, it can be effectively used also when many types of coatingliquid are used.

[0020] An etching apparatus according to the invention includes: aliquid discharge device that feeds etching liquid to an etching portionof a member-to-be-processed, and a suction portion that sucks reactionproduct during the etching. Since the discharge unit includes the liquiddischarge device and the suction portion, it can supply the etchingliquid and at the same time can remove the reaction product generatedduring the etching.

[0021] Furthermore, the suction portion can be combined with the liquiddischarge device. When the suction device is thus disposed integrallywith the liquid discharge device, the reaction product generated duringthe etching can be instantaneously removed.

[0022] Still furthermore, the etching apparatus according to theinvention may include a discharge unit that includes a gas dischargeportion that supplies a reactive gas to an etching portion of amember-to-be-processed, a liquid discharge device that supplies a liquidcapable of dissolving the reactive gas to the etching portion, and thesuction portion that is disposed in the neighborhood of the gasdischarge portion or the liquid discharge portion and is capable ofsucking a reaction product. Thereby, in addition to coating of theliquid, the reaction product generated during the etching, and thereactive gas that has not contributed to the etching, can be rapidlyremoved.

[0023] The discharge unit can be disposed plurally. Thereby, the etchingliquids or the reactive gases and the liquids corresponding to aplurality of different films can be filled. Accordingly, the etching toa plurality of films can be applied by only one etching.

[0024] Furthermore, the discharge head can be provided with a heater.Thereby, a reaction speed of a member-to-be-processed can be enhanced,and a reaction product can be inhibited from dewing.

BRIEF DESCRIPTION OF THE DRAWINGS

[0025]FIG. 1 is a schematic explaining etching in forming a bankaccording to a first exemplary embodiment;

[0026]FIG. 2 is a schematic explaining etching due to wettabilitycontrol of a member-to be processed according to a second exemplaryembodiment;

[0027]FIG. 3 is a schematic explaining alteration of an etching depthinvolving the first exemplary embodiment;

[0028] FIGS. 4 (1) and 4 (2) are schematics explaining etching in amulti-layered film made of different types of film according to a thirdexemplary embodiment, where FIG. 4 (1) is a schematic showing a casewhere a member to be processed made of the multi-layered film made ofdifferent types of film is etched, and FIG. 4 (2) is a schematic showinga case where different types of film on the same plane are etched;

[0029] FIGS. 5 (1) and 5 (2) are schematics explaining etching accordingto a fourth exemplary embodiment where a reactive gas is used, whereFIG. 5 (1) is a schematic showing a case where the multi-layered filmmade of different types of film is etched, and FIG. 5 (2) is a schematicshowing a case where the different types of film on the same plane areetched;

[0030]FIG. 6 is a sectional view of a discharge unit provided with asuction portion according to a fifth exemplary embodiment;

[0031]FIG. 7 is a sectional view of a discharge unit provided with asuction portion according to a sixth exemplary embodiment.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

[0032] Exemplary embodiments of etching methods and apparatus accordingto the invention are detailed below reference to the drawings. Thosedescribed in the following are only part of exemplary embodimentsaccording to the invention, and the invention is not restricted thereto.

[0033] When a member to be processed 10 is etched, in one method anetching liquid 15, such as an HF aqueous solution, is directly coated onthe member to be processed 10, and in the other method in an atmospherewhere a reactive gas 22, such as a fluorine-based gas, is present, aliquid capable of dissolving the reactive gas 22 is coated on the memberto be processed 10, and the reactive gas 22, the liquid, and the memberto be processed 10 are reacted, and thereby the etching is performed. Inthe present exemplary embodiment, unless particularly described, liquidscapable of dissolving the reactive gas, such as pure water or alcohol,and the etching liquids, such as an HF aqueous solution, arecollectively described as a coating liquid 14.

[0034] An explanatory schematic of the etching according to a firstexemplary embodiment of the invention is shown in FIG. 1. First, amember to be processed 10 is cleaned, and in order to etch the member tobe processed 10, a bank 12 is formed on a surface of the member to beprocessed 10 in a predetermined pattern shape. The bank 12 is coatedwith a coating liquid 14, or coated with pure water in an atmosphere ofa reactive gas 22. The bank 12 is liquid repelling, and can inhibit thecoating liquid 14 from scattering in the surroundings of the patternshape. Furthermore, a surface of such bank 12 is formed of a film thatis resistant to the coating liquid 14 or the reactive gas 22 of theetching.

[0035] The bank 12 is formed as follows. First, a resist that is liquidrepelling to the coating liquid 14 is coated on a surface of the memberto be processed 10. This is exposed to a predetermined pattern shapefollowed by developing, and thereby the bank 12 is provided with adesired pattern shape. Since the bank 12 is made of liquid repellingresist, it has a characteristic that repels the coating liquid 14.

[0036] Alternatively, when a fluorine-based resin is coated on a surfaceof the member to be processed 10, and followed by exposing it to anelectromagnetic wave, formation of a film of a composition of thefluorine-based resin at a portion that is irradiated with theelectromagnetic wave can be inhibited. Accordingly, when theelectromagnetic wave is irradiated in the pattern shape, in the liquidrepelling bank 12, a pattern is formed. Since the fluorine-based resinis highly liquid repelling to all types of liquid, it is effective alsowhen many types of coating liquids 14 are used. In exposing thefluorine-based resin like this, as the electromagnetic wave light can bepreferably used, and furthermore the light is preferable to beultra-violet light. Since the ultra-violet light is inexpensive, safe,and easy to handle, the simplification of fabricating process and thereduction of fabricating cost can be accomplished.

[0037] Still alternatively, an ordinary resist is coated on a surface ofa member to be processed 10 followed by applying patterning, the resistis fluorinated by treatment. Thereby, a liquid repelling bank 12 isformed, and a pattern is formed on a surface of the member to beprocessed 10.

[0038] Thus, when the liquid repelling bank 12 is formed, in the case ofthe coating liquid 14 being coated running over the pattern shape, sincea runover portion is rendered the coating liquid 14 repelling bytreatment, the coating liquid 14 outside of the pattern shape can beinhibited from adhering. Furthermore, since the coating liquid 14repelled by the repelling bank 12 is introduced into the pattern shapesurrounded by the bank 12, and followed by etching, the etching accuracycan be enhanced.

[0039] Furthermore, in the exemplary embodiment, the material of thebank 12 is liquid repelling, or by later applying liquid repellingtreatment to the bank, the bank 12 is rendered liquid repelling.However, by controlling a dropping amount of the etching liquid, or byproperly selecting an etching liquid that does not etch the bank,without rendering the bank liquid repelling, treatment can be applied.Still furthermore, when the pattern accuracy is allowed to be relativelyrough, the bank 12, which forms a pattern formation region to which theetching liquid of a processing liquid is supplied, may not beparticularly rendered liquid repelling by treatment, in this case a bankthat is no liquid repelling can be used.

[0040] On a surface of the member to be processed 10 thereon the bank 12is thus formed, in order to enhance the fixing properties of thedischarge liquid of the etching, the discharge liquid can be renderedmore lyophilic by treatment in a portion where the bank 12 is notformed. This can be realized by irradiating ultra-violet light or byapplying plasma treatment. That is, after the bank 12 is formedaccording to the above method, by irradiating electromagnetic wave suchas ultra-violet light on a region outside of the bank 12 formationrange, the film in the etching portion is de-bonded and removed.

[0041] Since thereby the portion other than the bank 12 is rendered morelyophilic, when the coating liquid 14 is coated on the member to beprocessed 10 during the etching, the coating liquid 14 can easilypermeate the portion. Furthermore, since the bank 12 is rendered liquidrepelling by treatment, the coating liquid 14, without adhering to thebank 12, is repelled and introduced in a portion that is lyophilic.Accordingly, when a region outside of the bank 12 formation range of themember to be processed 10 is rendered more lyophilic by treatment, thecoating liquid 14 can be easily fixed.

[0042] In the above, in a substrate surface of the member to beprocessed 10, the bank 12 is formed and thereby finer etching isintended to obtain. That is, in the case of the coating liquid 14 beingcoated in a pattern shape on the member to be processed 10, by formingthe bank 12, the coating liquid 14 is inhibited from running over arange of the desired pattern shape owing to the surface tension of theliquid. Furthermore, since the bank 12 is rendered liquid repelling bytreatment, the coating liquid 14 is repelled on the bank 12 andintroduced in the lyophilic patterned portion. That is, by forming thebank 12, a boundary of a coating liquid range when the coating liquid 14is coated is controlled. Accordingly, by forming the bank, accurateetching can be performed.

[0043] A second exemplary embodiment is shown in FIG. 2. In the abovemethod, the liquid repelling bank 12 is formed on a surface of themember to be processed 10, however, a method, in which a boundary of acoating region of the coating liquid 14 is controlled without formingthe bank 12, may be used. In this method, by controlling the lyophilicproperties on a surface of the member to be processed 10, the coatedcoating liquid 14 is enhanced in the fixing properties. For instance,after a mask is superposed on a surface of the member to be processed10, the UV light is irradiated thereon, thus a range that is lyophiliccan be formed. In the mask, a body is made of a transparent glasssubstrate, and on a portion corresponding to other than a patternformation range of the member to be processed 10, a light shielding filmmade of chromium metal or the like is formed. Accordingly, when the UVlight is irradiated on the member to be processed 10 that is covered bythe mask, the UV light is irradiated only on a portion where the lightshielding film is not present. Thereby, the patterned range of themember to be processed 10 is rendered lyophilic, accordingly, thecoating liquid 14 can be easily introduced. Thus, a boundary of a regionwhere the coating liquid 14 is coated can be controlled. In addition,other than the UV light, when plasma treatment or the like is applied,the similar effects can be attained.

[0044] As mentioned above, when the bank 12 is formed on a surface ofthe member to be processed 10 and thereby the pattern formation isapplied, the etching high in the accuracy of the pattern shape can beperformed. That is, while in the etching according to the related artmethod, when the member to be processed 10 is a SiO substrate, a minimumpattern width is substantially 20 μm, however, in the etching accordingto the exemplary embodiment, a minimum pattern width of 10 μm can beformed. Accordingly, finer device design can be performed.

[0045] As mentioned above, the bank 12 that controls the boundary wherethe coating liquid 14 is coated is formed, the coating liquid 14 isdischarged and coated, and thereby the member to be processed 10 isetched. According to the exemplary embodiment, in order to coat thecoating liquid 14 in a predetermined pattern formation range, a liquiddischarge head 16 is used as a liquid discharge device. This is becausewhen the liquid discharge head 16 is used as coating apparatus, thecoating liquid 14 can be coated only on the etching portion 18.Accordingly, since there is no need of coating the coating liquid 14 onan entire surface of the member to be processed 10, the coating liquid14 can be effectively saved. Furthermore, since the bank 12 may beformed only in the surroundings of a range where the coating liquid 14is coated by use of the liquid discharge head 16, the bank 12 can beformed in a minimum range. Accordingly, the cost can be effectivelyreduced. In addition, in the discharge nozzle 24 of the discharge head16, the surroundings of a nozzle opening portion is processed with amember having the liquid repelling properties and the solutionresistance. That is, when the nozzle opening portion is formed with, forinstance, fluororesin or the like, the etching liquid and the coatingliquid 14, such as pure water, are inhibited from adhering. Furthermore,it is preferable that a flow path of the etching liquid, such as anozzle interior of the liquid discharge head, is rendered liquidresistant by treatment.

[0046] In the exemplary embodiment, as mentioned above, the coatingliquid 14 is coated by use of the liquid discharge head 16. Bycontrolling a discharge amount of the coating liquid 14 at the liquiddischarge head 16, an etching depth of the member to be processed 10 inthe same type of material can be altered. In FIG. 3, an explanatoryschematic of the etching depth alteration according to the firstexemplary embodiment is shown.

[0047] That is, it is assumed that when the coating liquid 14 is set ata slight amount in a liquid amount and coated on the member to beprocessed 10, the etching depth of the member to be processed 10 is X,and when the coating liquid 14 is increased in its amount and coated onthe member to be processed 10, the etching depth can be increased by Y.In the related art method, the coating liquid 14 is uniformly coated onthe member to be processed 10, in order to alter the etching depth, theetching has to be repeated several times. However, in the exemplaryembodiment, a coating range of the coating liquid 14 is controlled byuse of the liquid discharge head 16, thus the etching depth can besimply altered. Furthermore, in this case, since the etching depth canbe altered by the liquid amount of the coating liquid 14, only bycontrolling the liquid amount of the coating liquid 14 by use of theliquid discharge head 16, the etching depth of the member to beprocessed 10 can be freely altered. That is, according to a position ofthe etching portion, the depth can be altered at will.

[0048] In FIG. 4 (1), an explanatory schematic of etching according to athird exemplary embodiment is shown.

[0049] When a plurality of the liquid discharge heads 16, such asmentioned above, is mounted to etching apparatus, multiple liquiddischarge head can be obtained. This is effective when the etchingliquid 15, such as an HF aqueous solution, is directly coated on themember to be processed 10 and thereby the etching is carried out. In therespective liquid discharge heads 16 constituted in multiple, theetching liquids 15 corresponding to the etchings of different types offilm are filled in, respectively. When the respective etching liquids 15are filled in the discharge heads 16 in advance, and the dischargenozzles 24 of the discharge heads 16 are controlled so as tosuccessively switch the etching liquids 15, the etching corresponding toa plurality of film qualities can be performed at once.

[0050] A case where a member to be processed 10 that is made of amulti-layered film and is subjected to the etching will be considered,in which, for instance, two types or more of film 20 are formed into amulti-layer, that is, a film 20A is laminated on top of a film 20B. Ingeneral, when such a member is etched, at first, the etching is appliedto the film 20A with the etching liquid 15 a to remove the film 20A, thetop layer of the member to be processed 10, and thereafter the coatingliquid 14 is changed, and the etching is applied to the film 20B withthe etching liquid 15 b.

[0051] According to the exemplary embodiment, since the discharge head16 is constituted into a multi-head and thereby different types ofetching liquid 15 are allowed to fill in corresponding liquid dischargeheads 16, the etching liquid 15 a can be filled in one liquid dischargehead 16, and the etching liquid 15 b can be filled in the other liquiddischarge head 16. The etching is performed by coating the member to beprocessed 10 with the etching liquid 15 a at first, and thereafter bysuccessively coating the member to be processed 10 with the etchingliquid 15 b. That is, when the etching liquid 15 is switched inaccordance with the type of the film 20, the member to be processed 10,in which two types or more of film 20 are laminated, can be etched atonce. Thus, in the etching of the member to be processed 10 in whichmany types of film 20 are laminated in a multilayer, when the liquiddischarge head 16 is constituted into a multi-head, in addition tosaving labor hours for exchanging the etching liquid 15 for each of thefilm, labor hours to repeat the etching process from the beginning foreach of the film can be saved.

[0052] At this time, outside of the etching portion 18, the bank 12 isformed and the bank 12 is rendered liquid repelling by treatment.Accordingly, there is no concern of the etching liquid 15, scatteredfrom the liquid discharge head 16 during the coating, adhering to thebank 12, and such an etching liquid 15 is repelled from on the bank 12and introduced into the lyophilic etching portion 18. Accordingly, inthe outside of the etching portion 18, excessive etching action can beinhibited from applying, and thereby the etching can be effectivelyapplied.

[0053] Furthermore, in FIG. 4 (2), an exemplary modification of thethird exemplary embodiment is shown.

[0054] Such a multi-liquid discharge head 16 is also effective even whendifferent types of film are coated on same plane. When many types offilm like this are present on same plane, according to the related artmethod, in accordance with the type of the film 20, the etching liquid15 is exchanged, that is, the etching is repeated the number of thedifferent types of film 20. However, according to the exemplaryembodiment, by switching the etching liquid 15 filled in themulti-liquid discharge head 16 in accordance with each of the film 20,the etching of different types of film can be successively carried out.For instance, when two types of film have been formed on same plane ofthe member to be processed 10, according to the related art method, theetching liquid 15 has to be exchanged for each of the film qualities tobe etched, that is, in total two times of the etching are necessary.However, according to the exemplary embodiment, the respective etchingliquids 15 are filled in advance in the multi-liquid discharge head 16,and by switching the etching liquid 15 for each of the film 20, twotypes of film 20 can be etched at once in etching.

[0055] At this time, the outside of the etching portion 18 such as thebank 12 is rendered liquid repelling by treatment. Accordingly, sincethe etching liquid 15 is repelled, an unnecessary portion can beinhibited from being etched. Furthermore, since a portion where the bank12 is not formed, that is, the etching portion 18 is rendered lyophilicby treatment, the etching liquid 15 can rapidly permeate and the etchingcan be performed instantaneously.

[0056] Furthermore, as mentioned above, when an amount of liquid of theetching liquid 15, which is coated from the liquid discharge head 16, iscontrolled, the etching depth can be controlled. Thus, by controllingthe amount of liquid for each of the liquid discharge heads 16 and byswitching the liquid discharge head 16 according to the film qualities,the member to be processed 10 can be simply and rapidly etched.

[0057] In FIG. 5 (1), an explanatory schematic of the etching accordingto the fourth exemplary embodiment is shown.

[0058] In the etching of the member to be processed 10, a case isconsidered, in which a reactive gas 22 for use in the etching iscontained in an atmosphere, pure water or alcohol is coated in a rangeof the etching, pure water or alcohol, the reactive gas 22, and themember to be processed 10 are allowed to react, and thereby the etchingis carried out. When there is a plurality of different types of film inthe member to be processed 10, in order to etch the different types offilm, the reactive gas 22 has to be altered for each of the film 20. Atthis time, the coating liquid 14, such as pure water or alcohol, that iscoated on the member to be processed 10 is preferable to be the sametype to save the labor hours in exchanging the coating liquid 14.

[0059] When the different types of film are etched, a plurality ofreactive gases 22 is filled in advance in different containers, and thetype of the reactive gas 22 is switched according to the film 20 to beetched. Accordingly, the member to be processed 10 that has differenttypes of film can be successively etched by switching the reactive gas22. Such a reactive gas is discharged from the gas discharge portion 17,and the coating liquid 14, such as pure water, is discharged from theliquid discharge head 16 into the atmosphere.

[0060] For instance, in the case of a member to be processed 10 that isconstituted in a multi-layered film by laminating a film 20A and a film20B that are different in the type, a reactive gas 22A and a reactivegas 22B are filled in advance. When the film 20A in an upper layerportion is etched, the reactive gas 22 a is discharged into theatmosphere, the coating liquid 14 is coated in a predetermined patternshape, and thereby allowing reacting with the member to be processed 10.After the film 20A coated on the member to be processed 10 is removed,the reactive gas 22 is switched to discharge the reactive gas 22B intothe atmosphere, and thereby the film 20B is etched.

[0061] In FIG. 5 (2), an exemplary modification of the etching involvinga fourth exemplary embodiment is shown.

[0062] Even when a film 20A and a film 20B that are different in thetype are formed on the same plane of the member to be processed 10, itis needless to say that by similarly switching the type of the reactivegas 22, the etching can be successively carried out.

[0063] As mentioned above, in the case of a multi-layered film in whichdifferent types of processing members are laminated, and in the case ofdifferent types of film being present on the same plane, different typesof the members to be processed 10 can be successively etched, andthereby the etching process can be shortened. At this time, bycontrolling a concentration of the reactive gas 22, speed of the etchingcan be controlled. That is, by setting the concentration of the reactivegas 22 in the atmosphere at a higher value, the etching speed can beaccelerated or decelerated, that is, the etching speed can be controlledat will.

[0064] Furthermore, when a processing member constituted of amulti-layered film that has two or more types of film, or a member to beprocessed 10 that has two types or more of film 20 on the same plane, isetched, a mechanism that controls a liquid amount of the coating liquid14 such as pure water or alcohol, is provided to the liquid dischargehead 16. Since the etching depth can be altered according to the liquidamount of the coating liquid 14, by disposing the mechanism thatcontrols the liquid amounts of these, a device by which the etchingdepth can be altered can be designed. Furthermore, it is effective alsowhen through holes are formed in the multi-layered substrate.

[0065]FIG. 6 is a sectional view showing a discharge unit provided witha suction portion according to a fifth exemplary embodiment.

[0066] When a material, such as fluororesin, whose decomposition isaccelerated by virtue of heat is used, a pattern formation time periodcan be shortened by heating during the formation of the pattern. When aheater 32 is disposed, in addition to allowing enhancing the reactionspeed between the coating liquid 14 and the member to be processed 10,the reactive gas 22 that is used in the etching, and unnecessarymaterials, such as water generated by the reaction, can be rapidlyvaporized. From this, by disposing the heater 32, substantial dryetching can be realized.

[0067] In the case of HF gas is used as the reactive gas 22 in theatmosphere in the etching of, for instance, a SiO₂ film, when theetching is performed at room temperature, in some cases, owing to thedew condensation of HF, a chemical reaction is induced in the SiO₂ filmin a portion other than a predetermined etching portion 18, resulting inetching the portion other than the etching portion 18. In thisconnection, the heater 32 is disposed and controlled so as to heat to atemperature between a temperature at which the HF gas dews withdifficulty (30 degree centigrade or more) and a temperature where a timeperiod up to vaporization of water is not too short (60 degreecentigrade or less), thereby inhibiting the HF gas from dewing, andthereby allowing etching the etching portion 18. The reason to set theupper limit to a heating temperature of the heater 32 is that, in thecase of the coating liquid 14 being pure water, when the heatingtemperature of the member to be processed 10 exceeds 60 degreecentigrade and becomes higher, vaporization time of water-dropletbecomes extremely short, and furthermore the sheet separation may occur.Accordingly, sufficient etching pattern cannot be obtained, resulting indisturbing the etching. In order to inhibit this from occurring, theheating temperature due to the heater 32 is restricted.

[0068] Furthermore, also by disposing the heater 32 to the dischargehead 16, the effect can be obtained. In the surroundings of the liquiddischarge head 16 and the gas discharge portion 17, there are materialsthat tend to induce chemical reactions, such as the etching liquid, andthe coating liquid 14, such as pure water or alcohol, and the reactivegas 22 in the atmosphere. In this connection, in the surroundingsthereof, the heater 32 is disposed, thereby the reactive gas 22 and thereaction product are inhibited from dewing or adhering, the vaporizationthereof is accelerated, and thereby an adverse affect on the member tobe processed 10 is inhibited. Thereby, the flying accuracy of the liquiddroplet can be maintained, resulting in excellent etching.

[0069] Still furthermore, in the surroundings of the liquid dischargehead 16, a suction portion 26 is disposed. FIG. 7 is a sectional view ofa discharge unit that is provided with a suction portion according to asixth exemplary embodiment. This is an exemplary embodiment in a methodin which the etching liquid 15 such as an HF aqueous solution isdirectly coated on the member to be processed 10.

[0070] The liquid discharge head 16 is provided with a discharge nozzle24, and the etching liquid 15 is supplied under pressure from a solutiontank (not shown) to the discharge nozzle 24. In the surroundings of thedischarge nozzle 24, an annularly formed suction exhaust path 28 isdisposed, and with a suction portion 26 including such an ejectormechanism that makes use of air pressure, the surroundings of the nozzleare sucked. The suction portion 26 and the discharge nozzle 24 areintegrally formed, and the coating of the etching liquid 15, and thesuction of the atmosphere are simultaneously carried out.

[0071] Furthermore, at a lower portion of the member to be processed 10,a heater 32 is disposed, thereby in addition to heating appropriatelythe member to be processed 10 to accelerate the reaction of the etching,the reaction products and so on are promoted to vaporize. In thesurroundings of the discharge nozzle 24, such reaction products(vaporized water and so on) are present, and when these adhere to themember to be processed 10 and the discharge nozzle 24, a non-intentionalreaction may be caused, and the etching may be disturbed. Accordingly,by means of the suction portion 26 disposed in the surroundings of thedischarge nozzle 24, unnecessary reaction products are removed.

[0072] Still furthermore, in an etching method, which fills reactive gas22 of the etching atmosphere sufficiently in the surroundings of themember to be processed 10, and the coating liquid 14, such as purewater, is coated, a sectional view of the discharge head 16 portion whenthe suction portion 26 is provided is shown.

[0073] From the discharge nozzle 24 of the liquid discharge head 16, thecoating liquid 14, such as pure water, is coated, which is suppliedunder pressure from a solution tank (not shown). In the surroundings ofthe discharge nozzle 24, annular paths are doubly disposed, an insidepath supplying the reactive gas 22, an outside path being a path to suckand exhaust the atmosphere of the etching. At this time, in theneighborhood of the nozzle opening portion, the inside reactive gassupply path 30 meets with a discharge path of the coating liquid 14coated from the nozzle opening portion, and thereby the reactive gas 22and the coating liquid 14 are simultaneously supplied to the member tobe processed 10. Furthermore, the suction and exhaust path 28 disposedon the outside, provided with an annular suction opening disposedoutside of a discharge opening of the coating liquid 14 and the reactivegas 22, sucks the atmosphere by use of an ejector mechanism (not shown)that makes use of an air pressure. Thus, the coating liquid 14 path andthe reactive gas 22 path and the suction and exhaustion path 28 areintegrally formed, and this is regarded as a suction portion 26.

[0074] Under the member to be processed 10, the heater 32 is disposed,and thereby the member to be processed 10 is appropriately heated toaccelerate the reaction of the etching, and at the same time thereaction product is accelerated in vaporizing. In the etching methodthat uses the reactive gas 22, the reactive gas 22 that has notcontributed to the reaction lingers indefinitely in the atmosphere, insome cases, generates an unintentional reaction product and has anadverse affect on the etching, accordingly, has to be removed rapidly.In this connection, the suction portion 26 rapidly removes the reactionproduct, the reactive gas 22 that has not contributed to the reaction,and vaporized water or gas from member to be processed 10.

[0075] In the etching in which the atmosphere is sucked by use of thesuction portion 26, the member to be processed 10 to which the abovebank 12 is formed can be used. Since the bank 12 is rendered liquidrepelling by treatment, there are no concerns of the adherence of thecoating liquid 14. Furthermore, since the etching is performed in aportion where the bank 12 is not formed, when the banks 12 are formed inadvance with a small spacing, finer etching can be performed.Accordingly, without depending on the dimension of the liquid droplet ofthe coating liquid 14, the etching can be performed at will. Stillfurthermore, since the coating liquid 14, repelled by the liquidrepelling bank 12, is rapidly introduced into a lyophilic portionoutside of a range of the bank 12, the fixing properties of the coatingliquid 14 can be enhanced, resulting in the efficient etching.

[0076] Thus, according to the invention, since the liquid repelling bank12 is formed in the surroundings of the etching pattern shape, a portionoutside of a range of the pattern shape is treated so as to repel thecoating liquid 14. Accordingly, when the coating liquid 14 is coatedwith running over portion that is the outside of the pattern shapeduring the etching, the coating liquid 14 can be inhibited from adheringin the outside of the pattern shape range. Furthermore, the coatingliquid 14, repelled by the liquid repelling bank 12, is introducedinside of the pattern shape surrounded by the bank 12, and the etchingis carried out there, accordingly, the etching accuracy can be enhanced.

[0077] Furthermore, since the liquid discharge head 16 and the suctionportion 26 are integrally formed, the reaction products or the likescattered in the surroundings of the discharge nozzle 24 can be rapidlyremoved. Accordingly, materials detrimental to the etching can bepromptly removed, resulting in exhibiting an effect in an enhancement insafety. Alternatively, the liquid discharge head 16 and the suctionportion can be separately configured.

[0078] Still furthermore, the etching methods and the apparatusaccording to the invention can be applied to various technical fields.For instance, the etching methods and the apparatus according to theinvention can be applied, for example, to the pattern formation ofsilicon substrates, and the pattern formation of hard masks whenfabricating color filters and EL (electro-luminescence) devices.

What is claimed is:
 1. An etching method characterized in that a bank isdisposed in the surroundings of an etching portion of a member to beprocessed, an etching liquid is supplied into the bank by use of aliquid discharge means, and thereby the etching portion is etched.
 2. Anetching method characterized in that a bank is disposed in thesurroundings of an etching portion of a member to be processed, thesurroundings of the etching portion are rendered a reactive gasatmosphere, and a liquid capable of dissolving the reactive gas issupplied into the bank by use of a liquid discharge means, and therebythe etching portion is etched.
 3. The etching method as set forth inclaim 1 or 2 characterized in that the etching portion is renderedlyophilic by treatment.
 4. An etching method characterized in that anetching portion of a member to be processed is rendered lyophilic bytreatment, an etching liquid is supplied to the etching portion by useof a liquid discharge means, and thereby the etching portion is etched.5. An etching method characterized in that an etching portion of amember to be processed is rendered lyophilic by treatment, thesurroundings of the etching portion are rendered a reactive gasatmosphere, and a liquid capable of dissolving the reactive gas issupplied to the etching portion by use of a liquid discharge means, andthereby the etching portion is etched.
 6. The etching method as setforth in any one of claim 1, 2, 4 or 5 characterized in that the etchingis carried out with a reaction product removed by suction.
 7. Theetching method as set forth in any one of claim 1, 2, 4 or 5characterized in that the etching is carried out with the member to beprocessed heated.
 8. The etching method as set forth in claim 7characterized in that a member to be processed is heated to atemperature in the range of 30 to 60 degree centigrade.
 9. The etchingmethod as set forth in claim 1 or 2 characterized in that the bank isrendered liquid repelling by treatment, or has a characteristic ofliquid repelling.
 10. The etching method as set forth in any one ofclaim 1, 2, 4 or 5 characterized in that the bank is made of afluororesin film.
 11. An etching apparatus characterized in comprising aliquid discharge means that supply an etching liquid to an etchingportion of a member to be processed, and a suction portion that sucks areaction product during the etching.
 12. The etching apparatus as setforth in claim 11 characterized in that the suction portion is combinedwith the liquid discharge means.
 13. An etching apparatus characterizedin comprising a discharge unit that includes a gas discharge portionthat supplies a reactive gas to an etching portion of a member to beprocessed, a liquid discharge means that supply liquid capable ofdissolving the reactive gas to the etching portion, and a suctionportion that is disposed in the neighborhood of the gas dischargeportion or the liquid discharge portion and capable of sucking areaction product.
 14. The etching apparatus as set forth in any one ofclaims 11 through 13 characterized in that the discharge unit isdisposed plurally.
 15. The etching apparatus as set forth in any one ofclaims 11 through 13 characterized in that the discharge head isprovided with a heater.